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Tag: highly

Semiconductors & Hardware

Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging

Sholih Cholid Hamdy, September 13, 2026

As semiconductor architectures move toward increasingly dense, fine-pitch interconnects, the reliance on high-performance materials to…

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Network Infrastructure & 5G

Samsung Poised to Unveil Next-Generation Foldables and AI-Powered Wearables at Highly Anticipated Galaxy Unpacked Event.

Nanda Ismailia, July 22, 2026

Today, July 22nd, marks a pivotal moment for the technology industry as Samsung Electronics hosts…

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Network Infrastructure & 5G

Samsung’s One UI 9 Beta Introduces Highly Anticipated PIN Requirement for Powering Off, Revolutionizing Smartphone Anti-Theft Measures

Nanda Ismailia, May 31, 2026

The long-standing demand from smartphone users across various operating systems, including Android and iOS, for…

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Network Infrastructure & 5G

Samsung’s Highly Anticipated One UI 8.5 Rollout Experiences Unforeseen Delay, Prompting Official Clarification and Revised Expectations.

Nanda Ismailia, May 2, 2026

The eagerly awaited stable release of Samsung’s One UI 8.5, the company’s proprietary Android overlay,…

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Semiconductors & Hardware

Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000.

Sholih Cholid Hamdy, April 30, 2026

In a landmark development for the semiconductor industry, researchers at the Korea Advanced Institute of…

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Enterprise Software & DevOps

Anthropic Releases Claude Opus 4.7, a Refined Iteration with Enhanced Capabilities and a Strategic Link to the Highly Anticipated Mythos Preview

Edi Susilo Dewantoro, April 16, 2026

Anthropic has announced the immediate availability of Claude Opus 4.7, an incremental but significant upgrade…

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