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Tag: packaging

Semiconductors & Hardware

The Economic and Technical Imperative for Panel-Level Packaging in the AI Era

Sholih Cholid Hamdy, April 16, 2026

The global semiconductor industry is currently navigating a fundamental transition in how advanced microchips are…

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Semiconductors & Hardware

Photonic Packaging Resistant to Extreme Environments (NIST, Johns Hopkins, U. Of Maryland)

Sholih Cholid Hamdy, April 12, 2026

The Limitations of Traditional Photonic Packaging Integrated photonics has seen rapid advancement over the last…

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Semiconductors & Hardware

Semiconductor Industry Pivot Breakthroughs in Verification Advanced Packaging and Geopolitical Resilience Define the Global Landscape

Sholih Cholid Hamdy, April 10, 2026

The global semiconductor ecosystem is currently navigating a period of intense technological acceleration and geopolitical…

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Semiconductors & Hardware

Impact of Gravity on Strip Warpage in Electronic Packaging Simulations

Sholih Cholid Hamdy, March 19, 2026

The mechanical behavior of electronic packages has emerged as a cornerstone of modern semiconductor manufacturing,…

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