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Tag: level

Semiconductors & Hardware

The Shift Toward System-Level Confidence: Insights from the 2026 Siemens EDA and Wilson Research Group Functional Verification Study

Sholih Cholid Hamdy, September 24, 2026

The semiconductor industry is currently navigating a critical inflection point where the traditional definition of…

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Semiconductors & Hardware

System-level Power Integrity Analysis Using The Innovator 3D IC Solution Suite

Sholih Cholid Hamdy, September 17, 2026

The rapid shift toward heterogeneous integration—often referred to as the "More than Moore" era—has placed…

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Semiconductors & Hardware

The Path to High Volume Fine Pitch Hybrid Bonding and the Challenges of Die Level Integration

Sholih Cholid Hamdy, July 17, 2026

Hybrid bonding has successfully transitioned from a laboratory curiosity to a cornerstone of modern semiconductor…

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Semiconductors & Hardware

A Self-Evolving Agent Framework That Treats Hardware Design as Repository-Level Code Evolution (Nvidia Research)

Sholih Cholid Hamdy, July 1, 2026

The Architecture of Autonomous Evolution At the core of the HORIZON framework is the conceptualization…

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Semiconductors & Hardware

Optimizing High-Bandwidth Memory Performance Through Last-Level Cache Integration in Modern SoC Design

Sholih Cholid Hamdy, June 27, 2026

The rapid evolution of artificial intelligence and high-performance computing has placed unprecedented demands on semiconductor…

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Semiconductors & Hardware

ASE Expands Advanced Packaging Capabilities with High-Throughput Panel-Level Platforms for AI and HPC Applications

Sholih Cholid Hamdy, June 21, 2026

The global semiconductor landscape reached a significant milestone on June 18, 2026, as ASE (Advanced…

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Semiconductors & Hardware

Optimizing AI Silicon Performance Through Advanced SystemC Transaction Level Modeling and Data Movement Analysis

Sholih Cholid Hamdy, May 30, 2026

The landscape of artificial intelligence silicon development is currently defined by a stark divergence between…

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Semiconductors & Hardware

The Evolution of System-Level Power Integrity in Advanced Packaging and the Transition to 3D-IC Architectures for Artificial Intelligence

Sholih Cholid Hamdy, May 8, 2026

The global semiconductor industry is currently navigating a pivotal transition that marks the end of…

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Semiconductors & Hardware

Securing the Modular Future: Establishing Platform-Level Trust in Chiplet-Based Semiconductor Architectures

Sholih Cholid Hamdy, May 7, 2026

The semiconductor industry is currently undergoing a fundamental transition from monolithic System-on-Chip (SoC) designs to…

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Digital Transformation & Strategy

Physical AI Taking Human-Robot Collaboration to a New Level

Diana Tiara Lestari, April 18, 2026

The Capgemini Research Institute has released a comprehensive 140-page study detailing the emergence of physical…

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